Recently, Dow Corporation (NYSE code: DOW) has been honored with 5 "R&D 100" awards, including 3 product awards and the prestigious 2023 researcher awards. Additionally, they have received special recognition for their outstanding commitment to corporate social responsibility.
The R&D Award program is designed for enterprises, governments, and academic research and development institutions worldwide. Established in 1963, this award is the only technology recognition in the world that acknowledges new products, technologies, and materials of significantly technological importance that can be sold or authorized.
Dr. Bharat Indu Chaudhary from Dow was honored with the 'R&D Annual Researcher Award' in the first category of the 'R&D Professional Award', recognizing his recent achievements in designing SI-LINK ™ and significantly enhancing product performance through DFDF-5451 NT rapid moisture curing of vinyl silane copolymers.
「Introduction to award-winning products and technologies」
01
DOW’S ™ TC-4083
Dispensible thermal conductive pad
As an innovative silicone solution that combines high thermal conductivity, excellent dispensing performance, and exceptional thermal stability, this can assist in achieving more efficient thermal management for 5G communication base stations, advanced driving assistance systems (ADAS), and autonomous driving chipsets, which will meet the growing data demands of the communication industry while also helping to enhance connectivity. Furthermore, it will aid the autonomous driving industry in meeting diverse future travel requirements by reducing casualties and improving the driving for comfort.
02
ENDURANCE™ HFDD-4201
Chemical compound
This is a fully developed high-voltage insulation product for cable systems, specifically designed for underground and submarine cables up to 500 kV (500k volts). It features a brand new, more sustainable, and patented cross-linking polyethylene material that can reduce methane byproducts by over 70% compared to those existing materials.
03
Solvent free SYL-OFF ™ SL 184
Release agent
The innovative technology developed by Dow effectively solves the long-standing atomization problems in the pressure sensitive industry, enabling customers to produce pressure sensitive adhesive labels with exceptional release performance at incredibly fast production speeds. This release agent cures quickly and maintains a low release force at both low and high release speeds, significantly reducing downtime in various applications such as the pressure sensitive adhesive release film composite process.
About DOW’S
Dow Corporation (NYSE code: DOW) combines its global presence, integrated assets, and economies of scale with a strong focus on innovation and expertise in materials science. The company is committed to achieving profitable growth while contributing to a sustainable future. Dow aims to be at the forefront as a leading global materials science company, emphasizing innovation, customer-oriented, inclusivity, and sustainable development. With its diverse portfolio encompassing plastics, industrial intermediates, coatings, and silicone business, Dow offers a wide range of technology-driven products and solutions for customers in rapidly growing markets such as packaging, infrastructure, transportation and consumer applications.
